购买 ADI AD9364BBCZ AD9364BBCZ

ADI

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AD9364BBCZ

型号

AD9364BBCZ

类目

RF Chip/Antenna > Wireless Transceiver Chip

制造商/品牌

ADI

封装

BGA-144

包装

the tray

包裹数量

184

简介

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AD9364BBCZ Product details
GENERAL DESCRIPTION
The AD9364 is a high performance, highly integrated radio frequency (RF) Agile Transceiver™ designed for use in 3G and 4G base station applications. Its programmability and wideband capability make it ideal for a broad range of transceiver applications.
The device combines an RF front end with a flexible mixed-signal baseband section and integrated frequency synthesizers, simplifying design-in by providing a configurable digital interface to a processor. The AD9364 operates in the 70 MHz to 6.0 GHz range, covering most licensed and unlicensed bands. Channel bandwidths from less than 200 kHz to 56 MHz are supported.

FEATURES
RF 1 × 1 transceiver with integrated 12-bit DACs and ADCs
Band: 70 MHz to 6.0 GHz
Supports time division duplex (TDD) and frequency division
duplex (FDD) operation
Tunable channel bandwidth (BW): <200 kHz to 56 MHz
3-band receiver: 3 differential or 6 single-ended inputs
Superior receiver sensitivity with a noise figure of <2.5 dB
Rx gain control
Real-time monitor and control signals for manual gain
Independent automatic gain control
2-band differential output transmitter
Highly linear broadband transmitter
Tx EVM: ≤−40 dB
Tx noise: ≤−157 dBm/Hz noise floor
Tx monitor: ≥66 dB dynamic range with 1 dB accuracy
Integrated fractional-N synthesizers
2.4 Hz maximum local oscillator (LO) step size
Multichip synchronization
CMOS/LVDS digital interface

APPLICATIONS
Point to point communication systems
Femtocell/picocell/microcell base stations
General-purpose radio systems

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Analog Devices AD9364BBCZ, RF Transceiver IC 70MHz to 6000MHz 144-Pin CSPBGA
Pin Count--------144
Part Category--------Integrated Circuit
Package Category--------BGA
Footprint Name--------BGA - 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-144-7)

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AD9364BBCZ Frequently Asked Questions (FAQs)

What is the recommended PCB layout and stack-up for optimal performance of the AD9364BBCZ?
A 4-layer PCB with a stack-up of signal-GND-power-signal is recommended. Keep sensitive analog signals away from digital signals and ensure good decoupling and grounding.

How do I optimize the AD9364BBCZ's performance for my specific application?
Use the ADI's AD9364BBCZ evaluation board as a reference design and modify it according to your specific requirements. Optimize the component values, PCB layout, and firmware settings for your application.

What is the maximum data rate that can be achieved with the AD9364BBCZ?
The AD9364BBCZ can support data rates up to 61.44 MSPS. However, the actual data rate achievable depends on the specific application, PCB design, and system architecture.

How do I ensure the AD9364BBCZ's RX and TX paths are properly calibrated?
Use the ADI-provided calibration routines and follow the recommended calibration procedure outlined in the datasheet. Ensure that the device is properly configured and that the calibration is performed at the desired operating frequency.

What are the key considerations for thermal management of the AD9364BBCZ?
Ensure good airflow around the device, use a heat sink if necessary, and follow the recommended thermal design guidelines outlined in the datasheet. Monitor the device's temperature and adjust the system design accordingly.